Careers

Responsibilities:

• Hardware simulation
• Hardware debugging
• Design and develop multilayer PCBs, ranging from 16 to 20 layers, while ensuring optimal signal integrity, power integrity, and thermal considerations.
• Proficiency in routing mixed-signal circuits, including FPGA-based mixed signal boards
• Schematic capture and tools
• Implement appropriate safety measures for high current and voltage (ratings between 12-100V and high current ratings ranging from 200 to 500 Amps)
• Developing the PCB Layout and Design using CAD software in both Allegro and OrCAD (OrCAD, Cadstar, Eagle and KiCAD software development)
• Working on Footprint design & validation
• Work on Design power supplies, DC-DC converters, power traces, and Bus Bar calculations. (Component placement and wiring)
• Conduct SI (Signal Integrity) and PI (Power Integrity) analysis to ensure reliable PCB performance.
• Implement impedance-controlled board routing, DDR routing, and processor-on-board routing
• Develop and manage design constraints to ensure compliance with project specifications.
• Address thermal considerations in PCB designs, optimizing heat dissipation and thermal performance (Thermal testing of hardware)
• Implement Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Testability (DFT) standards, Utilize CAM350 Gerber validation tools for quality assurance.
• Well versed with RF fundamentals guidelines
• Highspeed digital fundamentals
• Documentation as per ISO company’s guidelines
• Perform other duties as necessary.

An ideal candidate shall have:  

• 4 to 6 years of experience in Multilayer(16 to 20 Layers) mixed signal routing, FPGA based mixed signal boards, High speed layout, EMI/EMC compliant practices.
• 2+ years of experience in 12-100V and 200 to 500 Amps rating.
• Must be strong in both Allegro and OrCAD 17.x
• Experience in power supplies, DC-DC converters, power traces, Bus Bar calculation, High voltage / High current isolation
• Must have hands on experience in Impedance controlled board routing, DDR routing, processor on board routing hands-on.
• Must be strong Knowledge on rules creation in Constraint.
• Must have strong experience in SI(Signal Integrity) analysis.
• Must have strong knowledge in PI(Power Integrity) analysis.
• Strong knowledge on the thermal consideration on the designs.
• Should have the thorough understanding of creepage and clearance and how to avoid during the design.
• Understanding of PCB/laminate materials and electrical parameters a plus.
• Must be strong in IPC standards Library footprint creation.
• Very good work experience on Complex and multi-layer boards.
• Very good experience in DFx standards (DFM / DFA / DFT).
• Must have working experience in Stacked and complex boards with high layer count.
• Must be strong in Constraints Driven methodology.
• Strong experience in CAM350 Gerber validation tool.
• Self-driven, motivated and show high productivity in PCB design and development

Qualification:

• BE/B Tech in ECE/EEE/EE

Experience:

• 4-6 years